Process flow and application fields of ultrapure water in the electronics industry

Process flow for preparing ultrapure water for electronics industry

The process of preparing ultrapure water in the electronics industry can be roughly divided into the following three types:

  1. The traditional water treatment method of using ion exchange resin to prepare ultrapure water in the electronics industry. The basic process is: raw water → multi-media filter → activated carbon filter → precision filter → intermediate water tank → anode bed → cathode bed → mixed bed (Multi-bed)→Ultra-pure water tank→Ultra-pure water pump→Post security filter→Water point
  2. The method of using reverse osmosis water treatment equipment and ion exchange equipment to prepare ultrapure water in the electronics industry. The basic process flow is: raw water → multi-media filter → activated carbon filter → precision filter → intermediate water tank → reverse osmosis equipment →Mixed bed (multi-bed)→Ultra-pure water tank→Ultra-pure water pump→Post security filter→Water point
  3. The method of using reverse osmosis equipment and electro-deionization (EDI) equipment to prepare ultra-pure water in the electronics industry. This is the latest process for preparing ultra-pure water, and it is also an environmentally friendly, economical, and has great potential for development. Ultrapure water preparation process, the basic process flow is: raw water → multi-media filter → activated carbon filter → precision filter → intermediate water tank → reverse osmosis equipment → electro deionization (EDI) → ultrapure water tank → ultrapure water pump → Rear-mounted security filter → water point

Application fields of ultrapure water in the electronics industry

  1. Ultra-pure water for semiconductor materials, devices, printed circuit boards and integrated circuit products and semi-finished products;
  2. Ultra-pure water for blending ultra-pure materials and ultra-pure chemical reagents;
  3. Ultrapure water used in laboratories and pilot plants;
  4. Surface polishing of automobiles and home appliances;
  5. Optoelectronic products;
  6. Other high-tech micro products;
EDI module

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